Chips · accelerators · NVIDIA
NVIDIA B200 · Blackwell
2,200 gigaflops of dense BF16 compute per watt, at 1,000 W
Shipped 26 Feb 2025; shipped after the first date promised, up to 2 months. Epoch AI names it at 19 AI data centers and no GPU cluster.
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Each figure in NVIDIA’s own words
one chip, dense compute; memory is high-bandwidth memory- BF16, dense
- 2,200 TFLOPS
FP16/BF16 Tensor Core Dense/Sparse 2.2/4.5 petaFLOPS 2.2/4.5 petaFLOPS
NVIDIA Blackwell Architecture Technical Brief (V2.1) (2.2 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”) - FP8, dense
- 4,500 TFLOPS
FP8/FP6 Tensor Core Dense/Sparse 4.5/9 petaFLOPS 4.5/9 petaFLOPS
NVIDIA Blackwell Architecture Technical Brief (V2.1) (4.5 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”) - FP4, dense
- 9,000 TFLOPS
FP4 Tensor Core Dense/Sparse 14/18 petaFLOPS 9/18 petaFLOPS
NVIDIA Blackwell Architecture Technical Brief (V2.1) (9 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”) - Memory
- 180 GB
186 GB HBM3E | 8 TB/s 186 GB HBM3E | 8 TB/s 180 GB HBM3E | 7.7 TB/s
NVIDIA Blackwell datasheet (Oct 2025) (read from a table with a column for each product, whose head reads “Technical Specifications1 GB200 NVL72 GB200 NVL4 HGX B200”) - Memory bandwidth
- 7.7 TB/s
186 GB HBM3E | 8 TB/s 186 GB HBM3E | 8 TB/s 180 GB HBM3E | 7.7 TB/s
NVIDIA Blackwell datasheet (Oct 2025) (read from a table with a column for each product, whose head reads “Technical Specifications1 GB200 NVL72 GB200 NVL4 HGX B200”) - Maximum power
- 1,000 W
Max thermal design power (TDP) 1100 W 1000W
NVIDIA Blackwell Architecture Technical Brief (V2.1) (read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”) - Compute per watt
- 2,200 GFLOPS/Wdense BF16 over maximum power; 4,500 GFLOPS/W at FP8
Per-GPU figures are for the HGX B200 GPU (second column of each table). The technical brief says 'Up to 192 GB'; the Blackwell datasheet gives 180 GB, which matches the DGX B200 total of 1,440 GB for 8 GPUs, so 180 GB is used. NVIDIA first said 'The Blackwell platform is in full production' on 2024-05-22, but its first statement of sales is the 2025-02-26 release used here.
1 dated promise and the shipment
each date links to the page it is quoted from- 18 Mar 2024 Promised Blackwell-based products available from partners starting later this year in 2024.
Blackwell-based products will be available from partners starting later this year.
NVIDIA Blackwell Platform Arrives to Power a New Era of Computing - 26 Feb 2025 Shipped: Blackwell in massive-scale production, billions of dollars in sales in its first quarter.
We've successfully ramped up the massive-scale production of Blackwell AI supercomputers, achieving billions of dollars in sales in its first quarter.
NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2025
Named at 19 AI data centers
H100-equivalents and power are the whole site’s today, with every chip it holds| Site | Owner | Country | H100e | MW | Chips |
|---|---|---|---|---|---|
| Colossus 2 | SpaceXAI | United States | 1,111,673 | 1,276 | B200, B300 |
| Microsoft Fairwater Atlanta | Microsoft | United States | 768,769 | 859 | B200 |
| OpenAI Stargate Abilene | Oracle | United States | 509,348 | 590 | B200, B300 |
| Microsoft Fairwater Wisconsin | Microsoft | United States | 445,680 | 442 | B200 |
| Colossus 1 | SpaceXAI | United States | 275,796 | 425 | H100, H200, B200 |
| CoreWeave Denton TX | CoreWeave | United States | 252,653 | 367 | B200 |
| Bridge Data Centres MY06 | ByteDance | Malaysia | 221,052 | 315 | A100, H100, B200 |
| Meta Rosemount | Meta | United States | 215,675 | 241 | B200 |
| Microsoft Goodyear | Microsoft | United States | 205,154 | 263 | H100, B200 |
| AWS New Albany | Amazon | United States | 201,112 | 255 | Trainium2, H100, H200, B200 |
| Coreweave Helios | CoreWeave | United States | 159,552 | 200 | B200 |
| Microsoft Project Osmium | Microsoft | United States | 155,634 | 228 | A100, H100, B200 |
| CoreWeave Ellendale ND | CoreWeave | United States | 93,482 | 88 | B200 |
| CoreWeave Chester VA | CoreWeave | United States | 88,428 | 114 | H100, B200 |
| Oracle Batam | Oracle | Indonesia | 84,386 | 94 | B200, B300 |
| CoreWeave Marble NC | CoreWeave | United States | 78,828 | 91 | B200 |
| Core42 Lake Mariner | Core42 | United States | 71,753 | 58 | B200 |
| CoreWeave Norway | CoreWeave | Norway | 50,773 | 55 | B200 |
| Vantage TX1 | Undisclosed | United States | 38,706 | 45 | B200 |
In no GPU cluster of Epoch AI’s list
Epoch AI’s list of AI supercomputers, which stops in July 2025Epoch AI’s names for this chip: B200.
Other NVIDIA chips
- Tesla V100 SXM2 417 gigaflops of dense FP16 compute per watt, at 300 W
- A100 SXM 80GB 780 gigaflops of dense BF16 compute per watt, at 400 W
- H100 SXM 1,414 gigaflops of dense BF16 compute per watt, at 700 W
- H200 SXM 1,414 gigaflops of dense BF16 compute per watt, at 700 W
- GH200 Grace Hopper Superchip 990 gigaflops of dense BF16 compute per watt, at 1,000 W
- GB200 Grace Blackwell Superchip 5,000 teraflops of dense BF16 compute a chip; NVIDIA publishes no power figure
- B300 (Blackwell Ultra) 2,000 gigaflops of dense BF16 compute per watt, at 1,100 W
- Rubin GPU 4,000 teraflops of dense BF16 compute a chip; NVIDIA publishes no power figure
- NVIDIA’s own pages, each linked beside the figure or date it gives. Each page was read and each quote checked on 23 Oct 2026.
- Where it runs: Epoch AI, AI data centers and Epoch AI, GPU clusters, CC BY 4.0.