Chips · accelerators · NVIDIA

NVIDIA B200 · Blackwell

2,200 gigaflops of dense BF16 compute per watt, at 1,000 W

Shipped 26 Feb 2025; shipped after the first date promised, up to 2 months. Epoch AI names it at 19 AI data centers and no GPU cluster.

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Each figure in NVIDIA’s own words

one chip, dense compute; memory is high-bandwidth memory
BF16, dense
2,200 TFLOPS FP16/BF16 Tensor Core Dense/Sparse 2.2/4.5 petaFLOPS 2.2/4.5 petaFLOPS NVIDIA Blackwell Architecture Technical Brief (V2.1) (2.2 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”)
FP8, dense
4,500 TFLOPS FP8/FP6 Tensor Core Dense/Sparse 4.5/9 petaFLOPS 4.5/9 petaFLOPS NVIDIA Blackwell Architecture Technical Brief (V2.1) (4.5 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”)
FP4, dense
9,000 TFLOPS FP4 Tensor Core Dense/Sparse 14/18 petaFLOPS 9/18 petaFLOPS NVIDIA Blackwell Architecture Technical Brief (V2.1) (9 PFLOPS on the page; read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”)
Memory
180 GB 186 GB HBM3E | 8 TB/s 186 GB HBM3E | 8 TB/s 180 GB HBM3E | 7.7 TB/s NVIDIA Blackwell datasheet (Oct 2025) (read from a table with a column for each product, whose head reads “Technical Specifications1 GB200 NVL72 GB200 NVL4 HGX B200”)
Memory bandwidth
7.7 TB/s 186 GB HBM3E | 8 TB/s 186 GB HBM3E | 8 TB/s 180 GB HBM3E | 7.7 TB/s NVIDIA Blackwell datasheet (Oct 2025) (read from a table with a column for each product, whose head reads “Technical Specifications1 GB200 NVL72 GB200 NVL4 HGX B200”)
Maximum power
1,000 W Max thermal design power (TDP) 1100 W 1000W NVIDIA Blackwell Architecture Technical Brief (V2.1) (read from a table with a column for each product, whose head reads “Table 3. System Specifications for HGX B300 and HGX B200 HGX B300 HGX B200”)
Compute per watt
2,200 GFLOPS/Wdense BF16 over maximum power; 4,500 GFLOPS/W at FP8

Per-GPU figures are for the HGX B200 GPU (second column of each table). The technical brief says 'Up to 192 GB'; the Blackwell datasheet gives 180 GB, which matches the DGX B200 total of 1,440 GB for 8 GPUs, so 180 GB is used. NVIDIA first said 'The Blackwell platform is in full production' on 2024-05-22, but its first statement of sales is the 2025-02-26 release used here.

1 dated promise and the shipment

each date links to the page it is quoted from
  1. 18 Mar 2024 Promised Blackwell-based products available from partners starting later this year in 2024. Blackwell-based products will be available from partners starting later this year. NVIDIA Blackwell Platform Arrives to Power a New Era of Computing
  2. 26 Feb 2025 Shipped: Blackwell in massive-scale production, billions of dollars in sales in its first quarter. We've successfully ramped up the massive-scale production of Blackwell AI supercomputers, achieving billions of dollars in sales in its first quarter. NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2025

Named at 19 AI data centers

H100-equivalents and power are the whole site’s today, with every chip it holds
AI data centers that name this chip
SiteOwnerCountryH100eMWChips
Colossus 2 SpaceXAI United States 1,111,673 1,276 B200, B300
Microsoft Fairwater Atlanta Microsoft United States 768,769 859 B200
OpenAI Stargate Abilene Oracle United States 509,348 590 B200, B300
Microsoft Fairwater Wisconsin Microsoft United States 445,680 442 B200
Colossus 1 SpaceXAI United States 275,796 425 H100, H200, B200
CoreWeave Denton TX CoreWeave United States 252,653 367 B200
Bridge Data Centres MY06 ByteDance Malaysia 221,052 315 A100, H100, B200
Meta Rosemount Meta United States 215,675 241 B200
Microsoft Goodyear Microsoft United States 205,154 263 H100, B200
AWS New Albany Amazon United States 201,112 255 Trainium2, H100, H200, B200
Coreweave Helios CoreWeave United States 159,552 200 B200
Microsoft Project Osmium Microsoft United States 155,634 228 A100, H100, B200
CoreWeave Ellendale ND CoreWeave United States 93,482 88 B200
CoreWeave Chester VA CoreWeave United States 88,428 114 H100, B200
Oracle Batam Oracle Indonesia 84,386 94 B200, B300
CoreWeave Marble NC CoreWeave United States 78,828 91 B200
Core42 Lake Mariner Core42 United States 71,753 58 B200
CoreWeave Norway CoreWeave Norway 50,773 55 B200
Vantage TX1 Undisclosed United States 38,706 45 B200

In no GPU cluster of Epoch AI’s list

Epoch AI’s list of AI supercomputers, which stops in July 2025

Epoch AI’s names for this chip: B200.

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