Chips · fabs
$26.4 billion in CHIPS Act awards goes to 17 US chip plants
Of the 5 plants with two or more dated production promises, 3 moved the date later. Japan’s ministry of industry awarded ¥1,704.7 billion to 4 of them. Each date is quoted from the owner’s or a government’s own page.
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TSMC wins the largest award, $6.6 billion for 3 plants
An award that covers several plants is counted once. A company-wide figure is shown, not added. Totals are by currency; nothing is converted.| Program | Amount | Stage | Plants |
|---|---|---|---|
| Japan METI (5G Promotion Act, specific semiconductor plan subsidy)24 Feb 2024 | ¥645.2 billion | final | TSMC Kumamoto 2 |
| Japan METI (5G Promotion Act, specific semiconductor plan subsidy)12 Sep 2025 | ¥500.0 billion | final | Micron Hiroshima |
| Japan METI (5G Promotion Act, specific semiconductor plan subsidy)17 Jun 2022 | ¥409.5 billion | final | TSMC Kumamoto 1 |
| Japan METI (5G Promotion Act, specific semiconductor plan subsidy)6 Feb 2024 | ¥150.0 billion | final | Kioxia Kitakami K2 |
| US CHIPS Act (NIST CHIPS Program Office)15 Nov 2024 | $6.6 billion | final | TSMC Arizona 1, TSMC Arizona 2, TSMC Arizona 3 |
| US CHIPS Act (NIST CHIPS Program Office)10 Dec 2024 | $6.2 billion | final | Micron Idaho 1, Micron Idaho 2, Micron New York |
| US CHIPS Act grant converted to U.S. government equity22 Aug 2025 | $5.7 billioncompany-wide, not added | disbursed | Intel Fab 52 |
| US CHIPS Act (NIST CHIPS Program Office)20 Dec 2024 | $4.7 billion | final | Samsung Taylor 1, Samsung Taylor 2 |
| US CHIPS Act (NIST CHIPS Program Office)26 Nov 2024 | $3.9 billion | final | Intel Fab 52, Intel Fab 62 |
| US CHIPS Act (NIST CHIPS Program Office)26 Nov 2024 | $1.5 billion | final | Intel Ohio One |
| US CHIPS Act (NIST CHIPS Program Office)14 Oct 2026 | $955 million | final | GlobalFoundries Malta |
| US CHIPS Act (NIST CHIPS Program Office)20 Dec 2024 | $900 million | final | Texas Instruments Sherman |
| US CHIPS Act (NIST CHIPS Program Office)15 Oct 2024 | $750 million | preliminary | Wolfspeed Mohawk Valley, Wolfspeed Siler City |
| US CHIPS Act (NIST CHIPS Program Office)19 Dec 2024 | $458 million | final | SK hynix Indiana |
| US CHIPS Act (NIST CHIPS Program Office)20 Dec 2024 | $407 million | final | Amkor Peoria |
3 of 5 plants with repeated promises pushed production later
production promises only; building milestones are in the record below · HBM packaging plants includedChip-plant building runs at $52.3 bn a year, 59% below its peak
private construction put in place, dollars a year at a seasonally adjusted annual rate · Census publishes no line for chip plants alone. Its computer, electronic and electrical line holds them beside plants for computers, electronics and electrical equipment, so this is a proxy.Data-center construction passed chip, electronics and electrical plants in April 2026: $61.9 bn against $57.9 bn a year, and $85.0 bn against $52.3 bn by August 2026. Building runs at 1.2 times its pace when the CHIPS Act passed. A month’s figure is what a year of work would cost at that month’s pace: it is not money committed, and not the tools inside the plant. The peak month is ringed. The newest month is preliminary; Census revises it in each of the next two releases.
Down on a year earlier for 22 months in a row, and by 45% in August 2026
Open the months
| Month | A year, at that pace | On a year | Of manufacturing | Data centers |
|---|---|---|---|---|
| Aug 2026preliminary | $52.3 bn | −45% | 31% | $85.0 bn |
| Jul 2026revised | $52.1 bn | −46% | 31% | $79.0 bn |
| Jun 2026revised | $52.1 bn | −48% | 31% | $72.7 bn |
| May 2026 | $54.8 bn | −48% | 32% | $65.7 bn |
| Apr 2026 | $57.9 bn | −46% | 33% | $61.9 bn |
| Mar 2026 | $61.4 bn | −44% | 34% | $58.1 bn |
| Feb 2026 | $64.1 bn | −44% | 35% | $57.4 bn |
| Jan 2026 | $67.0 bn | −42% | 37% | $56.2 bn |
| Dec 2025 | $70.8 bn | −39% | 39% | $55.5 bn |
| Nov 2025 | $78.0 bn | −35% | 40% | $53.0 bn |
| Oct 2025 | $84.4 bn | −28% | 42% | $54.3 bn |
| Sep 2025 | $90.2 bn | −28% | 44% | $50.7 bn |
| Aug 2025 | $95.4 bn | −23% | 45% | $49.1 bn |
| Jul 2025 | $96.7 bn | −23% | 45% | $47.8 bn |
| Jun 2025 | $99.5 bn | −21% | 46% | $46.9 bn |
| May 2025 | $104.8 bn | −15% | 47% | $48.2 bn |
| Apr 2025 | $107.2 bn | −13% | 47% | $52.8 bn |
| Mar 2025 | $109.3 bn | −9% | 48% | $46.6 bn |
| Feb 2025 | $113.7 bn | −7% | 48% | $46.4 bn |
| Jan 2025 | $115.5 bn | −5% | 49% | $45.3 bn |
| Dec 2024 | $115.9 bn | −4% | 48% | $44.7 bn |
| Nov 2024 | $120.5 bn | −0% | 48% | $41.0 bn |
| Oct 2024 | $118.0 bn | +5% | 48% | $40.0 bn |
| Sep 2024 | $124.8 bn | +24% | 50% | $37.6 bn |
| Aug 2024 | $123.3 bn | +22% | 50% | $36.7 bn |
| Jul 2024 | $125.6 bn | +28% | 51% | $36.1 bn |
| Jun 2024 | $126.4 bn | +27% | 51% | $35.3 bn |
| May 2024 | $123.7 bn | +27% | 51% | $32.3 bn |
| Apr 2024 | $123.5 bn | +24% | 51% | $28.1 bn |
| Mar 2024 | $120.2 bn | +34% | 51% | $30.2 bn |
| Feb 2024 | $122.4 bn | +47% | 52% | $28.3 bn |
| Jan 2024 | $121.5 bn | +55% | 52% | $26.4 bn |
| Dec 2023 | $120.8 bn | +73% | 53% | $24.2 bn |
| Nov 2023 | $121.0 bn | +98% | 53% | $23.9 bn |
| Oct 2023 | $112.6 bn | +91% | 52% | $23.7 bn |
| Sep 2023 | $100.4 bn | +93% | 49% | $21.3 bn |
| Aug 2023 | $100.9 bn | +124% | 49% | $20.5 bn |
| Jul 2023 | $98.0 bn | +130% | 49% | $19.6 bn |
| Jun 2023 | $99.3 bn | +195% | 50% | $18.7 bn |
| May 2023 | $97.4 bn | +188% | 49% | $18.2 bn |
| Apr 2023 | $99.5 bn | +234% | 50% | $17.9 bn |
| Mar 2023 | $90.0 bn | +223% | 48% | $18.0 bn |
| Feb 2023 | $83.1 bn | +203% | 47% | $17.9 bn |
| Jan 2023 | $78.5 bn | +199% | 46% | $15.6 bn |
| Dec 2022 | $69.8 bn | +217% | 44% | $14.2 bn |
| Nov 2022 | $61.1 bn | +184% | 40% | $13.9 bn |
| Oct 2022 | $58.8 bn | +232% | 42% | $12.8 bn |
| Sep 2022 | $52.1 bn | +362% | 38% | $14.6 bn |
| Aug 2022 | $45.1 bn | +313% | 35% | $13.1 bn |
| Jul 2022 | $42.5 bn | +272% | 34% | $12.8 bn |
| Jun 2022 | $33.6 bn | +213% | 29% | $12.2 bn |
| May 2022 | $33.9 bn | +343% | 29% | $12.1 bn |
| Apr 2022 | $29.8 bn | +294% | 27% | $12.2 bn |
| Mar 2022 | $27.9 bn | +242% | 27% | $11.3 bn |
| Feb 2022 | $27.4 bn | +251% | 27% | $10.6 bn |
| Jan 2022 | $26.2 bn | +265% | 27% | $11.0 bn |
| Dec 2021 | $22.0 bn | +171% | 23% | $11.3 bn |
| Nov 2021 | $21.6 bn | +152% | 23% | $10.6 bn |
| Oct 2021 | $17.7 bn | +86% | 20% | $9.7 bn |
| Sep 2021 | $11.3 bn | +22% | 14% | $10.8 bn |
| Aug 2021 | $10.9 bn | +31% | 13% | $10.5 bn |
| Jul 2021 | $11.4 bn | +16% | 14% | $9.8 bn |
| Jun 2021 | $10.7 bn | +10% | 14% | $9.3 bn |
| May 2021 | $7.7 bn | −13% | 10% | $9.3 bn |
| Apr 2021 | $7.6 bn | −23% | 10% | $9.4 bn |
| Mar 2021 | $8.2 bn | −16% | 11% | $10.3 bn |
| Feb 2021 | $7.8 bn | −15% | 10% | $9.1 bn |
| Jan 2021 | $7.2 bn | −24% | 9% | $9.3 bn |
| Dec 2020 | $8.1 bn | −13% | 11% | $9.2 bn |
| Nov 2020 | $8.6 bn | +1% | 12% | $9.2 bn |
| Oct 2020 | $9.5 bn | +0% | 13% | $9.3 bn |
| Sep 2020 | $9.2 bn | +2% | 13% | $10.1 bn |
| Aug 2020 | $8.4 bn | −10% | 11% | $9.1 bn |
| Jul 2020 | $9.8 bn | +14% | 13% | $8.8 bn |
| Jun 2020 | $9.7 bn | +16% | 13% | $9.0 bn |
| May 2020 | $8.8 bn | +11% | 12% | $8.7 bn |
| Apr 2020 | $9.8 bn | +22% | 13% | $8.9 bn |
| Mar 2020 | $9.7 bn | +31% | 12% | $9.4 bn |
| Feb 2020 | $9.1 bn | +33% | 12% | $9.7 bn |
| Jan 2020 | $9.4 bn | +44% | 12% | $9.4 bn |
| Dec 2019 | $9.3 bn | +35% | 12% | $7.9 bn |
| Nov 2019 | $8.4 bn | +28% | 10% | $9.6 bn |
| Oct 2019 | $9.5 bn | +53% | 12% | $9.1 bn |
| Sep 2019 | $9.0 bn | +43% | 11% | $8.1 bn |
| Aug 2019 | $9.3 bn | +57% | 12% | $8.8 bn |
| Jul 2019 | $8.6 bn | +58% | 11% | $8.8 bn |
| Jun 2019 | $8.4 bn | +62% | 10% | $8.9 bn |
| May 2019 | $8.0 bn | +36% | 10% | $8.7 bn |
| Apr 2019 | $8.0 bn | +81% | 10% | $7.8 bn |
| Mar 2019 | $7.4 bn | +71% | 9% | $7.6 bn |
| Feb 2019 | $6.9 bn | +54% | 9% | $8.0 bn |
| Jan 2019 | $6.5 bn | +70% | 8% | $8.1 bn |
| Dec 2018 | $6.9 bn | +122% | 9% | $8.0 bn |
| Nov 2018 | $6.6 bn | +126% | 9% | $7.1 bn |
| Oct 2018 | $6.2 bn | +132% | 8% | $7.9 bn |
| Sep 2018 | $6.3 bn | +154% | 8% | $6.3 bn |
| Aug 2018 | $5.9 bn | +145% | 8% | $7.0 bn |
| Jul 2018 | $5.4 bn | +180% | 8% | $7.5 bn |
| Jun 2018 | $5.2 bn | +181% | 7% | $7.1 bn |
| May 2018 | $5.9 bn | +208% | 8% | $7.0 bn |
| Apr 2018 | $4.4 bn | +150% | 6% | $6.6 bn |
| Mar 2018 | $4.3 bn | +183% | 6% | $6.5 bn |
| Feb 2018 | $4.5 bn | +254% | 6% | $6.2 bn |
| Jan 2018 | $3.9 bn | +143% | 6% | $6.1 bn |
| Dec 2017 | $3.1 bn | +79% | 4% | $5.7 bn |
| Nov 2017 | $2.9 bn | +61% | 4% | $5.5 bn |
| Oct 2017 | $2.7 bn | +64% | 4% | $5.0 bn |
| Sep 2017 | $2.5 bn | +26% | 4% | $4.7 bn |
| Aug 2017 | $2.4 bn | +19% | 4% | $4.4 bn |
| Jul 2017 | $1.9 bn | +1% | 3% | $4.7 bn |
| Jun 2017 | $1.8 bn | −13% | 3% | $4.6 bn |
| May 2017 | $1.9 bn | −3% | 3% | $5.0 bn |
| Apr 2017 | $1.8 bn | −6% | 2% | $4.2 bn |
| Mar 2017 | $1.5 bn | −18% | 2% | $4.0 bn |
| Feb 2017 | $1.3 bn | −50% | 2% | $4.2 bn |
| Jan 2017 | $1.6 bn | −39% | 2% | $4.0 bn |
| Dec 2016 | $1.7 bn | −57% | 2% | $4.5 bn |
| Nov 2016 | $1.8 bn | −53% | 2% | $4.0 bn |
| Oct 2016 | $1.6 bn | −56% | 2% | $3.7 bn |
| Sep 2016 | $2.0 bn | −44% | 3% | $4.2 bn |
| Aug 2016 | $2.0 bn | −47% | 3% | $4.6 bn |
| Jul 2016 | $1.9 bn | −54% | 2% | $4.2 bn |
| Jun 2016 | $2.1 bn | −13% | 3% | $4.6 bn |
| May 2016 | $2.0 bn | −42% | 2% | $4.2 bn |
| Apr 2016 | $1.9 bn | −40% | 2% | $4.4 bn |
| Mar 2016 | $1.9 bn | −44% | 2% | $4.1 bn |
| Feb 2016 | $2.5 bn | −21% | 3% | $3.8 bn |
| Jan 2016 | $2.6 bn | −19% | 3% | $3.2 bn |
| Dec 2015 | $4.1 bn | +27% | 5% | $3.1 bn |
| Nov 2015 | $3.9 bn | +10% | 5% | $3.0 bn |
| Oct 2015 | $3.8 bn | −10% | 4% | $2.8 bn |
| Sep 2015 | $3.5 bn | −13% | 4% | $2.8 bn |
| Aug 2015 | $3.8 bn | −8% | 5% | $2.8 bn |
| Jul 2015 | $4.2 bn | −6% | 5% | $2.7 bn |
| Jun 2015 | $2.5 bn | −53% | 3% | $3.9 bn |
| May 2015 | $3.4 bn | −43% | 4% | $3.3 bn |
| Apr 2015 | $3.1 bn | −48% | 4% | $2.3 bn |
| Mar 2015 | $3.3 bn | −50% | 4% | $2.1 bn |
| Feb 2015 | $3.2 bn | −56% | 4% | $1.9 bn |
| Jan 2015 | $3.2 bn | −58% | 4% | $1.9 bn |
| Dec 2014 | $3.2 bn | −68% | 5% | $1.7 bn |
| Nov 2014 | $3.5 bn | −55% | 5% | $2.0 bn |
| Oct 2014 | $4.2 bn | −46% | 6% | $1.8 bn |
| Sep 2014 | $4.1 bn | −47% | 7% | $1.9 bn |
| Aug 2014 | $4.2 bn | −41% | 7% | $2.0 bn |
| Jul 2014 | $4.5 bn | −44% | 8% | $1.8 bn |
| Jun 2014 | $5.3 bn | −23% | 9% | $1.7 bn |
| May 2014 | $5.9 bn | +5% | 11% | $1.8 bn |
| Apr 2014 | $6.0 bn | −19% | 11% | $1.8 bn |
| Mar 2014 | $6.6 bn | −11% | 13% | $1.7 bn |
| Feb 2014 | $7.2 bn | −3% | 13% | $1.7 bn |
| Jan 2014 | $7.7 bn | −2% | 14% | $1.6 bn |
Census’s “Computer/ electronic/ electrical” line, a part of Manufacturing, from the release of 1 October 2026: Computer/electronic industries manufacture computers, computer peripherals, communications equipment, and similar electronic products, and the components for such products.
Electrical industries manufacture products that generate, distribute, and use electrical power. Included are manufacturers of electric lighting equipment, household appliances, and other electrical equipment and components.
Manufacturing includes all buildings and structures at manufacturing sites. Office buildings and warehouses owned by manufacturing companies but not constructed at a manufacturing site are classified as "office" and "commercial" respectively.
The series starts in January 1993; the file holds every month. Earlier releases of this
line are not kept, so revisions are not shown; the data-center page keeps them for its line.
29 plants, by status
place, wafer size and technology as each owner describes the plant; each dated figure links to its quote| Plant | Place | Makes | Wafers a month | Investment | Status |
|---|---|---|---|---|---|
| Intel Fab 34Fab 34 | Leixlip, County Kildare, Ireland | Intel 4 and Intel 3 (EUV)300 mm | — | — | ramping or in productionas of 1 Apr 2026 |
| Kioxia Kitakami K2Kitakami Plant Fab2 (K2) | Kitakami, Iwate, Japan | 3D flash memory, 8th generation (218-layer BiCS)300 mm | 25,000 | — | ramping or in productionas of 29 Sep 2025 |
| SK hynix M15XM15X | Cheongju, North Chungcheong, South Korea | DRAM for HBM and next-generation DRAM300 mm | — | ₩20.0 trillion | ramping or in productionas of 22 Apr 2026 |
| Intel Fab 52Fab 52 (Ocotillo campus) | Chandler, Arizona, United States | Intel 18A300 mm | — | $20.0 billion | ramping or in productionas of 22 Jan 2026 |
| Texas Instruments ShermanSherman SM1 and SM2 (300mm fabs) | Sherman, Texas, United States | 65nm to 130nm analog and embedded processing300 mm | — | $40.0 billion | ramping or in productionas of 17 Dec 2025 |
| Wolfspeed Mohawk ValleyMohawk Valley fab (200mm SiC device fab) | Marcy, New York, United States | Silicon carbide power devices200 mm | — | — | ramping or in productionas of 24 Jun 2024 |
| Wolfspeed Siler CityJohn Palmour Manufacturing Center (SiC materials) | Siler City, North Carolina, United States | Silicon carbide crystal and wafer (materials)200 mm | — | $5.0 billion | ramping or in productionas of 24 Jun 2024 |
| Micron HiroshimaHiroshima fab: 1-gamma EUV DRAM and new cleanroom | Higashihiroshima, Hiroshima, Japan | 1-gamma (1γ) DRAM with EUV; next-generation DRAM and HBM300 mm | 40,000 | — | under constructionas of 4 Jul 2026 |
| Samsung Pyeongtaek P4Pyeongtaek Line 4 (P4) | Pyeongtaek, Gyeonggi, South Korea | memory300 mm | — | — | under constructionas of 31 Oct 2023 |
| Samsung Pyeongtaek P5Pyeongtaek Line 5 (P5) | Pyeongtaek, Gyeonggi, South Korea | memory300 mm | — | — | under constructionas of 16 Nov 2025 |
| SK hynix Yongin Y1Yongin Semiconductor Cluster first fab (Y1) | Yongin (Wonsam-myeon), Gyeonggi, South Korea | Next-generation DRAM including HBM300 mm | — | ₩31.0 trillion | under constructionas of 7 Aug 2026 |
| Samsung Taylor 1Taylor fab (first fab) | Taylor, Texas, United States | 2nm (CHIPS award page)300 mm | — | $17.0 billion | under constructionas of 30 Oct 2025 |
| SK hynix IndianaIndiana fab (HBM advanced packaging and R&D) | West Lafayette, Indiana, United States | Next-generation HBM packaging | — | $4.0 billion | under constructionas of 28 Aug 2026 |
| Amkor PeoriaArizona advanced packaging and test campus | Peoria, Arizona, United States | 2.5D and other advanced packaging | 14,500 | $7.0 billion | under constructionas of 6 Oct 2025 |
| SK hynix Yongin Y2Yongin Semiconductor Cluster second fab (Y2) | Yongin (Wonsam-myeon), Gyeonggi, South Korea | HBM and next-generation DRAM300 mm | — | ₩35.2 trillion | announcedas of 7 Aug 2026 |
| SK hynix M17M17 | Cheongju, North Chungcheong, South Korea | NAND300 mm | — | ₩19.1 trillion | announcedas of 7 Aug 2026 |
| Samsung Taylor 2Taylor second fab | Taylor, Texas, United States | logic300 mm | — | — | announcedas of 30 Jul 2026 |
| GlobalFoundries MaltaMalta (Fab 8) expansion and new 300mm fab | Malta, New York, United States | 300mm specialty technologies; silicon photonics and advanced packaging300 mm | — | $16.0 billion | announcedas of 14 Oct 2026 |
| Intel Ohio OneOhio One (Mod 1 and Mod 2) | New Albany (Licking County), Ohio, United States | Intel 14A and future nodes (CHIPS award page); Intel 18A-capable at announcement300 mm | — | — | paused or delayedas of 24 Jul 2025 |
| Intel MagdeburgMagdeburg leading-edge wafer fabrication site | Magdeburg, Saxony-Anhalt, Germany | Angstrom-era Intel process (not named)300 mm | — | €30.0 billion | cancelledas of 24 Jul 2025 |
| TSMC Kumamoto 1JASM first fab (Kumamoto) | Kikuyo, Kumamoto, Japan | 22/28nm (40nm also made); 12/16nm in the first plan300 mm | 45,000 | — | no status on record |
| TSMC Kumamoto 2JASM second fab (Kumamoto) | Kumamoto, Japan | 3nm (2026 plan); 6/7nm and 12nm in the 2024 plan300 mm | 6,000 | — | no status on record |
| TSMC Arizona 1TSMC Arizona first fab | Phoenix, Arizona, United States | N4 (4nm and 5nm FinFET)300 mm | — | — | no status on record |
| TSMC Arizona 2TSMC Arizona second fab | Phoenix, Arizona, United States | N3 (3nm FinFET)300 mm | — | — | no status on record |
| TSMC Arizona 3TSMC Arizona third fab | Phoenix, Arizona, United States | N2 and A16 (2nm-class nanosheet)300 mm | — | — | no status on record |
| Intel Fab 62Fab 62 (Ocotillo campus) | Chandler, Arizona, United States | logic300 mm | — | $20.0 billion | no status on record |
| Micron Idaho 1Idaho fab 1 (ID1) | Boise, Idaho, United States | Leading-edge DRAM300 mm | — | — | no status on record |
| Micron Idaho 2Idaho fab 2 (ID2) | Boise, Idaho, United States | Leading-edge DRAM300 mm | — | — | no status on record |
| Micron New YorkNew York megafab (Clay), fabs 1 and 2 | Clay (Onondaga County), New York, United States | Leading-edge DRAM300 mm | — | — | no status on record |
Every dated field, with its words
each date links to the page it is quoted fromIntel Fab 34 Intel · Leixlip, County Kildare, Ireland
- 15 Mar 2022Announced.
Fab 34, set to go online in 2023
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU - 15 Mar 2022 Promised go online in 2023.
Fab 34, set to go online in 2023
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU - 29 Sep 2023Production started.
Intel’s Fab 34 production milestone
Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4 Technology - 1 Apr 2026Status: ramping or in production.
Fab 34 is a high-volume semiconductor fabrication facility for products utilizing the Intel 4 and Intel 3 process technologies,
Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
Fab 34 started construction in 2019, before the 2020 scope line; it is kept because it ramped after 2020. Intel sold 49% of a Fab 34 joint venture to Apollo in 2024 and agreed to buy it back in 2026. Left out because their page could not be read when this record was checked: investment.
Kioxia Kitakami K2 Kioxia · Kitakami, Iwate, Japan
- 23 Mar 2022Announced.
it will begin construction of a state-of-the-art new fabrication facility (Fab2) at its Kitakami Plant
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Kitakami Plant - 23 Mar 2022 Promised construction completion in 2023 (building).
it will begin construction of a state-of-the-art new fabrication facility (Fab2) at its Kitakami Plant
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Kitakami Plant - 6 Feb 2024 Promised first shipment (Kitakami) in September 2025.
・生産能力：２．５万枚/月（１２インチ換算）
特定半導体生産施設整備等計画の概要 (Kioxia, 2023半経第002号) - 6 Feb 2024 Japan METI (5G Promotion Act, specific semiconductor plan subsidy): ¥150.0 billion, final. Yokkaichi and Kitakami together.
have been approved to receive an up to 150 billion yen subsidy,
Kioxia and Western Digital’s Joint Venture To Receive Up To 150 Billion Yen Government Subsidy for Yokkaichi and Kitakami Plants - capacity25,000 wafers a month. METI plan: 25,000 per month at Kitakami for the subsidized 8th-generation line.
・生産能力：２．５万枚/月（１２インチ換算）
特定半導体生産施設整備等計画の概要 (Kioxia, 2023半経第002号) - 29 Sep 2025Production started. Start of operation announced.
today announced the start of operation at the Fab2 (K2),
Kioxia and Sandisk Announce Beginning of Operation of Fab2 at Kitakami Plant, Japan to Meet the Market Demand Driven by AI - 29 Sep 2025Status: ramping or in production.
today announced the start of operation at the Fab2 (K2),
Kioxia and Sandisk Announce Beginning of Operation of Fab2 at Kitakami Plant, Japan to Meet the Market Demand Driven by AI
Kioxia did not state a cost for K2. The 2022 release said Kioxia would fund K2 from operating cash flow; the subsidy came later (2024).
SK hynix M15X SK hynix · Cheongju, North Chungcheong, South Korea
- 6 Sep 2022Announced.
A total of 15 trillion won will be injected over the next five years to build the fab
SK hynix to Build M15X Fab in Cheongju - 6 Sep 2022 Promised construction completion in 2025 (early) (building).
A total of 15 trillion won will be injected over the next five years to build the fab
SK hynix to Build M15X Fab in Cheongju - 24 Apr 2024 Promised construction completion for early mass production in November 2025 (building).
the total investment in building the new production base will be more than 20 trillion won
SK hynix to Produce DRAM From M15X in Cheongju - investment₩20.0 trillion. Long-term total for the new production base (5.3 trillion won for fab construction); 15 trillion won over 5 years in the 2022 plan
the total investment in building the new production base will be more than 20 trillion won
SK hynix to Produce DRAM From M15X in Cheongju - 22 Apr 2026Status: ramping or in production.
focusing on the ramp-up of M15X, infrastructure preparation on the Yongin cluster,
SK hynix Announces 1Q26 Financial Results
SK hynix did not state a date when volume production began. It said "ramp-up of M15X" in April 2026, so the status is ramping. The 2022 plan was paused in 2022-2023 per news; no primary page for that pause was found.
Intel Fab 52 Intel · Chandler, Arizona, United States
- 23 Mar 2021Announced.
This build-out represents an investment of approximately $20 billion,
Intel Announces Major Expansion in Arizona - 24 Sep 2021 Promised fully operational in 2024.
With the addition of the two new factories – to be named Fab 52 and Fab 62
Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona - 26 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $3.9 billion, final. Chandler share of the $7.865 billion Intel award (2 new fabs and 1 modernized fab).
Construction of 2 new leading-edge fabs and modernization of 1 existing fab
Intel Corporation (Arizona) – Chandler, AZ (award page) - 22 Aug 2025 US CHIPS Act grant converted to U.S. government equity: $5.7 billion, disbursed. Company-wide: unpaid CHIPS grants used to fund the government equity stake; not specific to this fab.
The government’s equity stake will be funded by the remaining $5.7 billion in grants previously awarded,
Intel and Trump Administration Reach Historic Agreement - investment$20.0 billion. Fab 52 and Fab 62 together
This build-out represents an investment of approximately $20 billion,
Intel Announces Major Expansion in Arizona - 9 Oct 2025Production started. Intel said Fab 52 is fully operational and set to reach high-volume production later in 2025; in January 2026 it said 18A ramped to high-volume manufacturing in Arizona.
Arizona’s Fab 52 is fully operational and set to reach high-volume production using Intel 18A later this year,
Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A - 22 Jan 2026Status: ramping or in production.
Intel 18A ramped to high-volume manufacturing in Arizona and Oregon,
Intel Reports Fourth-Quarter and Full-Year 2025 Financial Results
The 2021 target "fully operational in 2024" was for both new fabs. The $5.7 billion equity entry is company-wide; it is listed here for context and is not an extra award.
Texas Instruments Sherman Texas Instruments · Sherman, Texas, United States
- 17 Nov 2021Announced.
has selected Sherman as the location for their next 300-mm fabs, with potential of up to four fabs
Governor Abbott Announces Texas Instruments’ Potential $30 Billion Investment in Sherman - 18 May 2022 Promised production from the first Sherman fab in 2025.
Production from the first Sherman fab is expected in 2025.
Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plants in Sherman, Texas - 18 Jun 2025 Promised SM1 initial production in 2025.
investment of up to $40 billion dollars for four fabs
Texas Instruments plans to invest more than $60 billion to manufacture billions of foundational semiconductors in the U.S. - 20 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $900 million, final. Sherman share of the $1.61 billion TI award (Sherman and Lehi).
Construction of two high-volume 300-mm fabrication facilities
Texas Instruments (Texas) – Sherman, TX (award page) - investment$40.0 billion. Four fabs SM1 to SM4 (2025 statement); $30 billion for four fabs in 2021-2022
investment of up to $40 billion dollars for four fabs
Texas Instruments plans to invest more than $60 billion to manufacture billions of foundational semiconductors in the U.S. - 17 Dec 2025Production started. SM1 only. SM2 shell is complete; no production date stated.
Texas Instruments (TI) today announced the start of production at its newest semiconductor fab in Sherman, TX,
Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas - 17 Dec 2025Status: ramping or in production.
Texas Instruments (TI) today announced the start of production at its newest semiconductor fab in Sherman, TX,
Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas
TI states output in chips per day, not wafers per month. The Lehi, Utah fab (LFAB2, $700 million CHIPS share) is not in this record.
Wolfspeed Mohawk Valley Wolfspeed · Marcy, New York, United States
- 15 Oct 2024 US CHIPS Act (NIST CHIPS Program Office): $750 million, preliminary. Split across Siler City and Marcy; NIST lists the stage as PMT.
up to $750 million in proposed direct funding under the CHIPS and Science Act.
Wolfspeed (New York) – Marcy, NY (award page) - 24 Jun 2024Status: ramping or in production.
Wolfspeed’s Mohawk Valley silicon carbide fab has reached 20% wafer start utilization,
Wolfspeed Announces Key Milestones and Operational Update
No investment figure or capacity was found on primary pages. The CHIPS award stayed at the PMT stage on the NIST page; no final award is shown. Left out because their page could not be read when this record was checked: announced, productionStarted.
Wolfspeed Siler City Wolfspeed · Siler City, North Carolina, United States
- 9 Sep 2022Announced.
with an investment of approximately $5 billion over the next eight years in the Town of Siler City.
Governor Cooper Announces Wolfspeed Selects North Carolina for 445-Acre Manufacturing Campus - 24 Jun 2024 Promised crystal qualification in August 2024 (early).
has installed and recently activated initial furnaces less than one year after vertical construction commenced.
Wolfspeed Announces Key Milestones and Operational Update - 15 Oct 2024 US CHIPS Act (NIST CHIPS Program Office): $750 million, preliminary. Split across Siler City and Marcy; NIST lists the stage as PMT.
up to $750 million in proposed direct funding under the CHIPS and Science Act.
Wolfspeed (North Carolina) – Siler City, NC (award page) - investment$5.0 billion. Over eight years, as stated by the North Carolina Department of Commerce (2022)
with an investment of approximately $5 billion over the next eight years in the Town of Siler City.
Governor Cooper Announces Wolfspeed Selects North Carolina for 445-Acre Manufacturing Campus - 24 Jun 2024Status: ramping or in production.
has installed and recently activated initial furnaces less than one year after vertical construction commenced.
Wolfspeed Announces Key Milestones and Operational Update
This is a materials (wafer) plant, not a device fab. Wolfspeed had a Chapter 11 process in 2025; no primary page on its effect on these plants was read. Status may be old.
Micron Hiroshima Micron · Higashihiroshima, Hiroshima, Japan
- 3 Oct 2023 Promised first shipment, 1γ in the second quarter of 2026 (Micron fiscal, Dec 2025 to Feb 2026).
・主要製品：ＤＲＡＭ（１γ世代）
特定半導体生産施設整備等計画の概要 (Micron, 2023半経第001号) - 12 Sep 2025 Promised first shipment, next-generation DRAM in the fourth quarter of 2028 (Micron fiscal, Jun to Aug 2028) (later product).
・主要製品：次世代ＤＲＡＭ
特定半導体生産施設整備等計画の概要 (Micron, 2025半経第001号) - 4 Jul 2026 Promised equipment move-in for new cleanroom in the second half of 2028 (building).
広島工場（広島県東広島市）で新たなクリーンルームの着工を発表しました。
マイクロン、広島工場で新たなクリーンルームの着工を発表 - 3 Oct 2023 Japan METI (5G Promotion Act, specific semiconductor plan subsidy): ¥167.0 billion, final.
※最大助成額は1670億円
認定特定半導体生産施設整備等計画 - 12 Sep 2025 Japan METI (5G Promotion Act, specific semiconductor plan subsidy): ¥500.0 billion, final.
※最大助成額は1670億円
認定特定半導体生産施設整備等計画 - capacity40,000 wafers a month. METI plan for 1γ (2023-10-03). The 2025 METI plan for next-generation DRAM also states 40,000 per month.
・主要製品：ＤＲＡＭ（１γ世代）
特定半導体生産施設整備等計画の概要 (Micron, 2023半経第001号) - 4 Jul 2026Status: under construction.
広島工場（広島県東広島市）で新たなクリーンルームの着工を発表しました。
マイクロン、広島工場で新たなクリーンルームの着工を発表
This is an expansion of an existing fab, not a new site. No Micron primary page states that 1γ volume production began in Hiroshima. A 2022 METI plan (1β, up to 46.47 billion yen) is outside this record. Left out because their page could not be read when this record was checked: announced, investment, promises.
Samsung Pyeongtaek P4 Samsung · Pyeongtaek, Gyeonggi, South Korea
- 31 Oct 2023Announced.
progressing the P4 framework for mid- to long-term supply.
Samsung Electronics Announces Third Quarter 2023 Results - 31 Oct 2023Status: under construction.
progressing the P4 framework for mid- to long-term supply.
Samsung Electronics Announces Third Quarter 2023 Results
Samsung gives very little plant-level data for P4 in its newsroom. No capacity, cost or date was found. The status is old (2023). The Samsung newsroom search could not be read.
Samsung Pyeongtaek P5 Samsung · Pyeongtaek, Gyeonggi, South Korea
- 16 Nov 2025Announced.
삼성전자는 최근 임시 경영위원회를 열고 평택사업장 2단지 5라인의 골조 공사를 추진하기로 결정했다.
삼성, 국내에 향후 5년간 450조원 투자 - 16 Nov 2025 Promised full-scale operation in 2028.
삼성전자는 최근 임시 경영위원회를 열고 평택사업장 2단지 5라인의 골조 공사를 추진하기로 결정했다.
삼성, 국내에 향후 5년간 450조원 투자 - 16 Nov 2025Status: under construction.
삼성전자는 최근 임시 경영위원회를 열고 평택사업장 2단지 5라인의 골조 공사를 추진하기로 결정했다.
삼성, 국내에 향후 5년간 450조원 투자
Samsung did not state a P5 cost. News gives about 60 trillion won, but no Samsung statement of that figure was found.
SK hynix Yongin Y1 SK hynix · Yongin (Wonsam-myeon), Gyeonggi, South Korea
- 26 Jul 2024Announced.
decided to invest about 9.4 trillion won in building the first fab and business facilities
SK hynix Board Approves Yongin Semiconductor Cluster Investment Plan - 3 Apr 2024 Promised first fab completion in 2027 (early) (building).
with plans for completion in early 2027.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana - 24 Apr 2024 Promised first fab completion in May 2027 (building).
start construction of the first fab in Yongin in March next year and complete it in May 2027.
SK hynix to Produce DRAM From M15X in Cheongju - 26 Jul 2024 Promised first fab completion in May 2027 (building).
decided to invest about 9.4 trillion won in building the first fab and business facilities
SK hynix Board Approves Yongin Semiconductor Cluster Investment Plan - 25 Feb 2026 Promised first cleanroom opening (moved up from May 2027) in February 2027 (building).
This brings the total investment for the construction of the first fab to approximately 31 trillion KRW
New Facility Investment for Yongin Semiconductor Cluster - 7 Aug 2026 Promised first cleanroom opening in February 2027 (building).
Meanwhile, construction on Y1 is progressing smoothly toward its initial cleanroom opening target of February next year.
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - investment₩31.0 trillion. Total construction of the first fab (9.4 trillion won approved 2024, plus 21.6 trillion won approved 2026)
This brings the total investment for the construction of the first fab to approximately 31 trillion KRW
New Facility Investment for Yongin Semiconductor Cluster - 7 Aug 2026Status: under construction.
Meanwhile, construction on Y1 is progressing smoothly toward its initial cleanroom opening target of February next year.
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17
SK hynix states no capacity. It plans four fabs at Yongin by 2033 and about 600 trillion won in total. Korean government support is not stated in these pages.
Samsung Taylor 1 Samsung · Taylor, Texas, United States
- 24 Nov 2021Announced.
The estimated $17 billion investment in the United States
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas - 24 Nov 2021 Promised facility operational in the second half of 2024.
The estimated $17 billion investment in the United States
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas - 28 Jun 2023 Promised begin operation in the second half of 2024.
Construction of the new fab in Taylor is proceeding according to initial plans
Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 - 20 Dec 2024 Promised all facilities operational (whole CHIPS project) by 2030.
two leading-edge logic foundry fabs focused on mass production of 2nm process technologies
Samsung Electronics (Texas) – Taylor, TX (award page) - 30 Oct 2025 Promised begin operations in 2026.
beginning operations at the Company’s fab in Taylor, Texas in a timely manner.
Samsung Electronics Announces Third Quarter 2025 Results - 20 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $4.7 billion, final. Award covers Taylor (2 leading-edge fabs and an R&D fab) and the Austin expansion.
awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics - investment$17.0 billion. Buildings, property improvements, machinery and equipment, as stated in 2021
The estimated $17 billion investment in the United States
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas - 30 Oct 2025Status: under construction.
beginning operations at the Company’s fab in Taylor, Texas in a timely manner.
Samsung Electronics Announces Third Quarter 2025 Results
Samsung moved the date from 2024-H2 to 2026, but no Samsung primary page reached gives the 2024 to 2026 change. The January 2026 statement is from a news report quoting the earnings call, so it is marked secondary; its date is approximate (call in late January 2026). Left out because their page could not be read when this record was checked: promises.
SK hynix Indiana SK hynix · West Lafayette, Indiana, United States
- 3 Apr 2024Announced.
it will invest an estimated $3.87 billion in West Lafayette, Indiana
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana - 3 Apr 2024 Promised mass production in the second half of 2028.
it will invest an estimated $3.87 billion in West Lafayette, Indiana
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana - 19 Dec 2024 Promised mass production in the second half of 2028.
Mass production expected to begin second half of 2028
SK hynix (Indiana) – West Lafayette, IN (award page) - 28 Aug 2026 Promised mass production of next-generation HBM in the second half of 2029 (later product).
The Indiana fab, with a total expected investment of over $4 billion,
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana - 6 Aug 2024 US CHIPS Act (NIST CHIPS Program Office): $450 million, preliminary.
up to $450 million in proposed direct funding and access to proposed loans of $500 million
SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana - 19 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $458 million, final.
awarded SK hynix up to $458 million in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix - investment$4.0 billion. Total expected investment (stated in 2026; $3.87 billion in 2024)
The Indiana fab, with a total expected investment of over $4 billion,
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana - 28 Aug 2026Status: under construction.
The Indiana fab, with a total expected investment of over $4 billion,
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana
Groundbreaking was on 2026-08-27, more than two years after the announcement. The cleanroom is planned to open by October 2028.
Amkor Peoria Amkor · Peoria, Arizona, United States
- 26 Jul 2024Announced.
awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology - 20 Dec 2024 Promised mass production in the fourth quarter of 2027.
expected to produce approximately 14,500 wafers per month and 3,700,000 units per month
Amkor Technology, Inc. (Arizona) – Peoria, AZ (award page) - 6 Oct 2025 Promised production in 2028 (early).
increasing total project investment by more than $5 billion , to a total of $7 billion across two phases
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus - 26 Jul 2024 US CHIPS Act (NIST CHIPS Program Office): $407 million, preliminary.
awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology - 20 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $407 million, final.
awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology - capacity14,500 wafers a month. Stated by the U.S. Department of Commerce award page, not by Amkor.
expected to produce approximately 14,500 wafers per month and 3,700,000 units per month
Amkor Technology, Inc. (Arizona) – Peoria, AZ (award page) - investment$7.0 billion. Two phases (2025 statement); $1.7 billion expected capital expenditure on the CHIPS award page
increasing total project investment by more than $5 billion , to a total of $7 billion across two phases
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus - 6 Oct 2025Status: under construction.
increasing total project investment by more than $5 billion , to a total of $7 billion across two phases
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus
Amkor investor pages (ir.amkor.com) could not be read. The 2025 release was read on Nasdaq.com as a Business Wire copy of the Amkor release, so it is marked secondary.
SK hynix Yongin Y2 SK hynix · Yongin (Wonsam-myeon), Gyeonggi, South Korea
- 7 Aug 2026Announced.
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - 7 Aug 2026 Promised first cleanroom opening in June 2029 (building).
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - investment₩35.2 trillion. Y2 fab, support building, R&D center and infrastructure, through October 2031
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - 7 Aug 2026Status: announced.
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17
Groundbreaking is planned for July 2027. No capacity is stated.
SK hynix M17 SK hynix · Cheongju, North Chungcheong, South Korea
- 2 Jul 2026Announced.
KRW 80 trillion in the M17 NAND production fab
SK hynix Announces Investment Plan for the Chungcheong Region - 2 Jul 2026 Promised operations in the first half of 2029.
KRW 80 trillion in the M17 NAND production fab
SK hynix Announces Investment Plan for the Chungcheong Region - 7 Aug 2026 Promised first cleanroom opening in December 2028 (building).
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - investment₩19.1 trillion. M17 fab approved by the board in August 2026; the June 2026 plan said about 80 trillion won for M17 in the long term
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 - 7 Aug 2026Status: announced.
35.2 trillion won in Yongin “Y2” fab and 19.1 trillion won in the Cheongju “M17” fab
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17
Groundbreaking is planned for February 2027. No capacity is stated.
Samsung Taylor 2 Samsung · Taylor, Texas, United States
- 30 Jul 2026Announced.
second Taylor fab by the end of this year, targeting mass production in 2030.
Samsung Electronics to break ground on 2nd fab in Taylor within this year - 30 Jul 2026 Promised mass production in 2030.
second Taylor fab by the end of this year, targeting mass production in 2030.
Samsung Electronics to break ground on 2nd fab in Taylor within this year - 20 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $4.7 billion, final. Same award as Taylor fab 1; the award page names two leading-edge fabs.
awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics - 30 Jul 2026Status: announced.
second Taylor fab by the end of this year, targeting mass production in 2030.
Samsung Electronics to break ground on 2nd fab in Taylor within this year
The only statement is from the Q2 2026 earnings call, reported by news. No Samsung primary page was reached, so the source is secondary.
GlobalFoundries Malta GlobalFoundries · Malta, New York, United States
- 19 Feb 2024Announced.
awarded GlobalFoundries (GF) up to $1.5 billion in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries - 14 Oct 2026 Promised first new fab comes online in 2029.
a new 300mm semiconductor fab, which is expected to come online in 2029.
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative - 19 Feb 2024 US CHIPS Act (NIST CHIPS Program Office): $1.5 billion, preliminary. Malta and Burlington projects.
awarded GlobalFoundries (GF) up to $1.5 billion in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries - 20 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $1.5 billion, final. Malta share is $1.45 billion per the NIST award page.
awarded GlobalFoundries (GF) up to $1.5 billion in direct funding
Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries - 14 Oct 2026 US CHIPS Act (NIST CHIPS Program Office): $955 million, final.
amend its existing award and reallocate up to $955 million in incentives
Department of Commerce Announces Agreement with GlobalFoundries to Amend Its Existing CHIPS Program Award - investment$16.0 billion. New York and Vermont, includes more than $13 billion of existing expansion plans (2025 statement)
today announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth - 14 Oct 2026Status: announced.
a new 300mm semiconductor fab, which is expected to come online in 2029.
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative
In October 2026 GF said it will operate two new Malta fabs funded by Japan (up to $21 billion). The first new fab is to add about 900,000 wafers per year. That is per year, so capacityWspm is null.
Intel Ohio One Intel · New Albany (Licking County), Ohio, United States
- 21 Jan 2022Announced.
Intel today announced plans for an initial investment of more than $20 billion
Intel Announces Next US Site with Landmark Investment in Ohio - 21 Jan 2022 Promised production in 2025.
Intel today announced plans for an initial investment of more than $20 billion
Intel Announces Next US Site with Landmark Investment in Ohio - 26 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $1.5 billion, final. New Albany share of the $7.865 billion Intel award.
Construction of one greenfield leading-edge fab (with one additional fab being built)
Intel Corporation (Ohio) – New Albany, OH (award page) - 24 Jul 2025Status: paused or delayed.
Intel will further slow the pace of construction in Ohio to ensure spending is aligned with market demand.
Intel Reports Second-Quarter 2025 Financial Results
Intel moved the date at least once more in 2023 (to 2026-2027, reported by news); no Intel primary page for that change was reached, so it is not listed. The Ohio award page says one fab, with a second being built. Left out because their page could not be read when this record was checked: investment, promises.
Intel Magdeburg Intel · Magdeburg, Saxony-Anhalt, Germany
- 15 Mar 2022Announced.
Intel plans to initially invest 17 billion euros,
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU - 15 Mar 2022 Promised production in 2027.
Intel plans to initially invest 17 billion euros,
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU - 19 Jun 2023 Promised first facility enters production in 4 to 5 years after EU approval of the incentive package.
now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities
Intel, German Government Agree on Increased Scope for Wafer Fabrication Site in Magdeburg - investment€30.0 billion. Two fabs, per the revised 2023 agreement; first stated as 17 billion euros in 2022
now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities
Intel, German Government Agree on Increased Scope for Wafer Fabrication Site in Magdeburg - 24 Jul 2025Status: cancelled.
Intel will no longer move forward with planned projects in Germany and Poland.
Intel Reports Second-Quarter 2025 Financial Results
The German subsidy was never approved by the EC, so publicMoney is empty. Intel paused the project in September 2024 and ended it in July 2025.
TSMC Kumamoto 1 TSMC · Kikuyo, Kumamoto, Japan
- 17 Jun 2022 Promised first shipment in December 2024.
・生産能力：5.5 万枚/月（12 インチ換算）
特定半導体生産施設整備等計画の概要 (JASM, 2022半経第001号) - 17 Jun 2022 Japan METI (5G Promotion Act, specific semiconductor plan subsidy): ¥409.5 billion, final.
※最大助成額は4095億円
認定特定半導体生産施設整備等計画 - capacity45,000 wafers a month. METI amended plan (2026-10-16): 45,000 for 22/28nm, 50,000 for the whole plant. TSMC stated 45,000 in 2021; METI stated 55,000 in 2022.
・生産能力：4.5 万枚/月（12 インチ換算）※工場全体では 5.0 万枚/月（12 インチ換算）
変更後の認定特定半導体生産施設整備等計画の概要 (JASM, 2022半経第001号－2)
The original METI maximum subsidy for this plan is not on the current METI list; the list shows only the amended maximum. Left out because their page could not be read when this record was checked: announced, investment, productionStarted, promises, status.
TSMC Kumamoto 2 TSMC · Kumamoto, Japan
- 24 Feb 2024 Promised first shipment in the fourth quarter of 2027.
・生産能力：4.8 万枚/月（12 インチ換算） ※工場全体では 6.3 万枚/月（12 インチ換算）
特定半導体生産施設整備等計画の概要 (JASM, 2023半経第003号) - 16 Oct 2026 Promised first shipment in the fourth quarter of 2028.
・主要製品：ロジック半導体（3nm プロセス）
変更後の特定半導体生産施設整備等計画の概要 (JASM, 2023半経第003号－2) - 24 Feb 2024 Japan METI (5G Promotion Act, specific semiconductor plan subsidy): ¥645.2 billion, final.
※最大助成額は6451.5億円
認定特定半導体生産施設整備等計画 - capacity6,000 wafers a month. METI amended plan (2026-10-16) for 3nm. The 2024 METI plan said 48,000 per month.
・主要製品：ロジック半導体（3nm プロセス）
変更後の特定半導体生産施設整備等計画の概要 (JASM, 2023半経第003号－2)
The METI amended plan says the exact site in Kumamoto is still to be decided, so city is null. Construction start moved from end of 2024 (2024 statement) to 2025 (TSMC, 2025). Left out because their page could not be read when this record was checked: announced, investment, promises, status.
TSMC Arizona 1 TSMC · Phoenix, Arizona, United States
- 15 Nov 2024 Promised production in the first half of 2025.
Fab 1 : On track to start production in first half of 2025
TSMC Arizona – Phoenix, AZ (award page) - 15 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $6.6 billion, final. Award covers fabs 1 to 3 in Phoenix; up to $5 billion in loans also offered.
up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology
TSMC does not name the fab "Fab 21" in the pages used here. The 20,000 wafers per month figure is from 2020; TSMC did not restate it later. Left out because their page could not be read when this record was checked: announced, capacityWspm, investment, productionStarted, promises, publicMoney, status.
TSMC Arizona 2 TSMC · Phoenix, Arizona, United States
- 15 Nov 2024 Promised production in the second half of 2027.
Fab 2 : Expected to begin production in second half of 2027
TSMC Arizona – Phoenix, AZ (award page) - 15 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $6.6 billion, final. Same award as fab 1; covers fabs 1 to 3.
up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology
TSMC said the two first fabs will make over 600,000 wafers per year. That figure is per year and for two fabs, so capacityWspm is null. The node moved from 3nm (2022) to 2nm (2024) and back to 3nm (2026). Left out because their page could not be read when this record was checked: announced, investment, promises, status.
TSMC Arizona 3 TSMC · Phoenix, Arizona, United States
- 15 Nov 2024 Promised production by 2030 (end of the decade).
Fab 3 : Expected to begin production by the end of the decade
TSMC Arizona – Phoenix, AZ (award page) - 15 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $6.6 billion, final. Same award as fab 1; covers fabs 1 to 3.
up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology
No capacity figure is stated. TSMC said in 2025 that it will upgrade Arizona to N2 and more advanced nodes faster, but it gave no new date for this fab. Left out because their page could not be read when this record was checked: announced, investment, promises, status.
Intel Fab 62 Intel · Chandler, Arizona, United States
- 23 Mar 2021Announced.
This build-out represents an investment of approximately $20 billion,
Intel Announces Major Expansion in Arizona - 24 Sep 2021 Promised fully operational in 2024.
With the addition of the two new factories – to be named Fab 52 and Fab 62
Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona - 26 Nov 2024 US CHIPS Act (NIST CHIPS Program Office): $3.9 billion, final. Same Chandler award as Fab 52.
Construction of 2 new leading-edge fabs and modernization of 1 existing fab
Intel Corporation (Arizona) – Chandler, AZ (award page) - investment$20.0 billion. Fab 52 and Fab 62 together
This build-out represents an investment of approximately $20 billion,
Intel Announces Major Expansion in Arizona
No Intel primary page read here gives the status of Fab 62 after 2021. Status is null. The Intel newsroom (newsroom.intel.com) could not be read.
Micron Idaho 1 Micron · Boise, Idaho, United States
- 10 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $6.2 billion, final. Award covers 2 Idaho fabs and 2 New York fabs; $6.165 billion finalized 2024-12-10, raised to about $6.44 billion with Virginia.
awarded Micron Technology up to $6.165 billion in direct funding
Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects
Micron does not use the label "ID1" in these pages; it says "first Idaho fab". No capacity is stated. Left out because their page could not be read when this record was checked: announced, investment, promises, publicMoney, status.
Micron Idaho 2 Micron · Boise, Idaho, United States
- 10 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $6.2 billion, final. Award covers 2 Idaho fabs and 2 New York fabs; $6.165 billion finalized 2024-12-10, raised to about $6.44 billion with Virginia.
awarded Micron Technology up to $6.165 billion in direct funding
Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects
The NIST award page counts two Idaho fabs under the 2024 award. The $30 billion figure also covers other items. Left out because their page could not be read when this record was checked: announced, investment, promises, status.
Micron New York Micron · Clay (Onondaga County), New York, United States
- 10 Dec 2024 US CHIPS Act (NIST CHIPS Program Office): $6.2 billion, final. Award covers 2 Idaho fabs and 2 New York fabs; $6.165 billion finalized 2024-12-10, raised to about $6.44 billion with Virginia.
awarded Micron Technology up to $6.165 billion in direct funding
Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects
Groundbreaking was 2026-01-16 and first concrete was poured by 2026-07-09. The New York state money is an incentive package stated by Micron, not a grant award document. Left out because their page could not be read when this record was checked: announced, investment, promises, publicMoney, status.
19 plants left out, and why
a field goes in only with a quote this site could read on the page it cites- Intel Poland (Wrocław) assembly and test plant. A packaging plant, outside the scope of this record; Intel ended it with Magdeburg in 2025. No separate record made.
- TI Lehi, Utah LFAB2. Outside the scope of this record; investment for LFAB2 alone is not stated on the pages read. The CHIPS share is $700 million.
- Infineon Dresden Smart Power Fab. Stated investment is €3.5 billion (EC, 2025), below this record's US$5 billion threshold.
- Tata Electronics–PSMC Dholera fab, India. No primary government page was read for it.
- Samsung Austin expansion; Micron Manassas; GlobalFoundries Burlington. Expansions of old mature fabs; stated amounts are not plant-specific or are below threshold.
- TSMC Arizona fab 4 and packaging fabs as separate records. TSMC gives no data for each of them.
- SK hynix Cheongju P&T7 packaging plant. Stated 20 trillion won includes other facilities; completion end of 2027.
- Micron Taiwan Tongluo site (ex-PSMC P5). Site acquisition, not a new fab announcement with a stated investment over US$5 billion on the pages read.
- TSMC Arizona expansion: further fabs and advanced packaging fabs. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- ESMC Dresden fab. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Fab 20 (2nm, Hsinchu Science Park). No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Fab 22 (2nm, Kaohsiung). No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Singapore HBM advanced packaging facility. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Singapore advanced wafer fabrication facility (NAND). No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- IIM-1 (Innovative Integration for Manufacturing). No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Fab12i P3. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- VSMC 300mm fab (Tampines). No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Catania Campus integrated SiC plant. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Crolles new 300mm fab. No page that dates or sizes it could be read when this record was checked. It returns when one can be.
- Each owner’s press releases and filings, and the pages of NIST’s CHIPS Program Office, Japan’s Ministry of Economy, Trade and Industry and the other governments named above. Every quote links to its page. Each page was read and each quote checked on 19 Oct 2026.
- U.S. Census Bureau, Construction Spending: value of private construction put in place, seasonally adjusted annual rate, the “Computer/ electronic/ electrical” and “Data center” lines, release of 1 Oct 2026, retrieved 20 Oct 2026. Public domain; definitions and methodology.