Chips · stack
6 stages take a chip from raw material to the data center
Each stage below takes its rows from its own page, and links to it. Read it from the top: materials, tools, fabs, process nodes, memory, chip and package. Then the data centers that run the chips, and the power they draw.
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Materials
100% of the world’s primary gallium comes from China.
Materials: rows from /chips/materials/ Material Used in Largest producer Share Gallium compound semiconductors, the wafer China 100% Silicon metal the wafer China 87% Indium compound semiconductors, packaging China 69% Fluorspar etch and clean China 60% Arsenic compound semiconductors Peru 49% Helium fab gases United States 43% How USGS says gallium is used:
GaAs was used to manufacture compound semiconductor wafers used in integrated circuits (ICs) and optoelectronic devices
USGS, Mineral Commodity Summaries 2026 -
Tools
29% of a typical chip-tool maker’s sales go to China.
Tools: rows from /chips/books/ Tool maker Sold to China Year to Lam Research 32% 2026-06 KLA 30% 2026-06 ASML 29% 2025-12 Applied Materials 28% 2026-07 -
Fabs
$26.4 billion in CHIPS Act awards goes to 17 US chip plants.
Fabs: rows from /chips/fabs/ Status Plants For example ramping or in production 7 Intel Fab 52, Intel Fab 34, SK hynix M15X under construction 7 Samsung Taylor 1, Samsung Pyeongtaek P4, Samsung Pyeongtaek P5 announced 4 Samsung Taylor 2, SK hynix Yongin Y2, SK hynix M17 paused or delayed 1 Intel Ohio One cancelled 1 Intel Magdeburg -
Process nodes
15 of 19 process nodes shipped by the date first promised.
Process nodes: rows from /chips/nodes/ Company Nodes Kept Late Samsung 12 7 0 SK hynix 6 4 1 TSMC 3 3 0 Intel 5 0 2 Micron 4 1 1 -
Memory
Micron’s revenue grows to 4.8× its level of a year ago.
Memory: rows from /chips/memory/ Memory node Status Micron 1β (1-beta) up to 12 months late Micron 1γ (1-gamma) by the first date promised SK hynix 1bnm no dated delivery yet SK hynix 1cnm up to 10 months late Samsung 1b DRAM by the first date promised Samsung 1c delivered SK hynix HBM3E by the first date promised SK hynix HBM4 by the first date promised Samsung HBM3E by the first date promised Samsung HBM4 by the first date promised Micron HBM3E no dated delivery yet Micron HBM4 no dated delivery yet -
Chip and package
64 of the largest possible dies fit on a 300 mm wafer.
Chip and package: rows from /chips/cost/ Designer AI chips in Epoch AI’s data Amazon Trainium1, Trainium2 AMD MI300A, MI300X, MI308X, MI325X, MI350X, MI355X Google TPU v5e, TPU v5p, TPU v6e, TPU v7 NVIDIA B200, B300, H100/H200, H20
After the package: the data center and its power
- Data-center constructionUS data-center building rises 73% in a year, to $85.0 bn a year.
- The power bill of AI data centers$11.1 billion a year covers the full-load power of US AI sites.
Terms used on this page: industrial price , reticle limit , defect density , chiplet , interposer , high-bandwidth memory , herfindahl index , net import reliance , capital intensity , inventory days , Entity List , foreign direct product rule , gross margin , diffusion index , unit value , average selling price and bit shipments .
Through every stage: the cycle and the controls
- The chip cycle8 of 8 chip-cycle indicators improve on three months earlier.
- Export controls1,110 Chinese entries sit on the US Entity List, 6.6 times 2017’s.