Chips · nodes

15 of 19 process nodes shipped by the date first promised

The longest slip was Micron 1β (1-beta), up to 12 months after the first date promised. Each of the 51 dated promises is quoted from the company’s own page or filing.

Embed

The frame credits TSMC, Intel, Samsung, Rapidus, Micron, SK hynix and Kioxia and links back to its page. Preview it.

Cite
CSV Post on X

Each node from its first promised date to its delivery

A delivery is often the day a company said the node was already running, so a slip is an upper bound. A node with no dated delivery on record is not counted as late.
2020 2021 2022 2023 2024 2025 2026 2027 2028 today Logic TSMC N5: by the first date promised TSMC N5 TSMC N3: by the first date promised TSMC N3 TSMC N2: by the first date promised TSMC N2 Intel 4: past its date, no dated delivery on record Intel 4 Intel 3: after the first date promised Intel 3 Intel 20A: past its date, no dated delivery on record Intel 20A Intel 18A: after the first date promised Intel 18A Intel 14A: promised, not yet due Intel 14A Samsung SF3E: by the first date promised Samsung SF3E Samsung SF3: past its date, no dated delivery on record Samsung SF3 Samsung SF2: by the first date promised Samsung SF2 Samsung 2 nm gen 2: promised, not yet due Samsung 2 nm gen 2 Samsung SF2Z: promised, not yet due Samsung SF2Z Samsung SF1.4: promised, not yet due Samsung SF1.4 Rapidus 2nm GAA: promised, not yet due Rapidus 2nm GAA DRAM Micron 1β (1-beta): after the first date promised Micron 1β (1-beta) Micron 1γ (1-gamma): by the first date promised Micron 1γ (1-gamma) SK hynix 1bnm: past its date, no dated delivery on record SK hynix 1bnm SK hynix 1cnm: after the first date promised SK hynix 1cnm Samsung 1b DRAM: by the first date promised Samsung 1b DRAM Samsung 1c: delivered, no promise on record Samsung 1c HBM SK hynix HBM3E: by the first date promised SK hynix HBM3E SK hynix HBM4: by the first date promised SK hynix HBM4 Samsung HBM3E: by the first date promised Samsung HBM3E Samsung HBM4: by the first date promised Samsung HBM4 Micron HBM3E: past its date, no dated delivery on record Micron HBM3E Micron HBM4: promised, not yet due Micron HBM4 NAND SK hynix 238L NAND: by the first date promised SK hynix 238L NAND SK hynix 321L NAND: by the first date promised SK hynix 321L NAND Samsung V-NAND V8: by the first date promised Samsung V-NAND V8 Samsung V-NAND V9: by the first date promised Samsung V-NAND V9 Kioxia BiCS8: delivered, no promise on record Kioxia BiCS8
Ring: the end of a promised window. Dot: the delivery, at the end of its stated period. Solid line: a delivery after the first promise. Dashed line: a date moved later.

Samsung and TSMC met every first date they promised

a node is judged when the record holds a dated promise and a dated delivery
Nodes in the record by company: kept, late, open and moved
Company Nodes Kept Late Not yet due No dated delivery Dates moved later
Samsung 12 7 0 3 1 1
SK hynix 6 4 1 0 1 1
Intel 5 0 2 1 2 2
Micron 4 1 1 1 1 0
TSMC 3 3 0 0 0 0
Rapidus 1 0 0 1 0 0
Kioxia 1 0 0 0 0 0

Every promise and delivery, with its words

each date links to the page it is quoted from

Logic

TSMC N5 5 nm · by the first date promised
  1. 15 Apr 2020 Promised volume production in 2020. entered risk production of 5-nanometer technology, which is on track for volume production in 2020 TSMC annual report on Form 20-F for 2019, filed with the SEC
  2. 2020 Delivered: volume production. our 5-nanometer technology successfully entered volume production in 2020 TSMC annual report on Form 20-F for 2020, filed with the SEC

TSMC’s own sites could not be read when this record was checked, so this record uses TSMC’s 20-F filings with the SEC, which give years, not days.

TSMC N3 3 nm · by the first date promised
  1. 14 Apr 2022 Promised volume production in the second half of 2022. 3-nanometer technology, which we expect to enter volume production in the second half of 2022 TSMC annual report on Form 20-F for 2021, filed with the SEC
  2. 2022 Delivered: volume production. 2-nanometer technology, which we expect to enter volume production in 2025 TSMC annual report on Form 20-F for 2022, filed with the SEC

TSMC’s own sites could not be read when this record was checked, so this record uses TSMC’s 20-F filings with the SEC, which give years, not days.

TSMC N2 2 nm · by the first date promised
  1. 20 Apr 2023 Promised volume production in 2025. Our 5-nanometer technology and 3-nanometer technology successfully entered volume production in 2020 and 2022, respectively TSMC annual report on Form 20-F for 2022, filed with the SEC
  2. 18 Apr 2024 Promised volume production in 2025. the development of our 2-nanometer technology is on track, and its volume production is expected in 2025 TSMC annual report on Form 20-F for 2023, filed with the SEC
  3. 2025 Delivered: volume production. Our 2-nanometer technology entered volume production in 2025 TSMC annual report on Form 20-F for 2025, filed with the SEC

TSMC’s own sites could not be read when this record was checked, so this record uses TSMC’s 20-F filings with the SEC, which give years, not days.

Intel 4 Intel 4 (first Intel EUV node) · past its date, no dated delivery on record
  1. 26 Jul 2021 Promised ready for production in the second half of 2022. Intel 4 will be ready for production in the second half of 2022 for products shipping Intel Accelerates Process and Packaging Innovations (8-K Ex. 99.1)

Intel promised readiness for production, not high-volume manufacturing, so the slip is not exact. Intel did not restate a new Intel 4 date in the releases we read. 1 source could not be read when this record was checked, and its dates are left out.

Intel 3 Intel 3 · after the first date promised, up to 4 months
  1. 26 Jul 2021 Promised ready to begin manufacturing products in the second half of 2023. Intel 3 will be ready to begin manufacturing products in the second half of 2023. Intel Accelerates Process and Packaging Innovations (8-K Ex. 99.1)
  2. 25 Apr 2024 Delivered: high-volume production stated as running (statement date). With Intel 3 in high-volume production Intel Reports First-Quarter 2024 Financial Results (8-K Ex. 99.1)

Intel gives no exact start date for Intel 3 high-volume production. The delivered date is the first statement we found.

Intel 20A Intel 20A · past its date, no dated delivery on record
  1. 26 Jul 2021 Promised ramp in 2024. Intel 20A is expected to ramp in 2024. Intel Accelerates Process and Packaging Innovations (8-K Ex. 99.1)

Intel canceled 20A productization (announced 2024-09-04), so delivered is null and will stay null. 1 source could not be read when this record was checked, and its dates are left out.

Intel 18A Intel 18A · after the first date promised, up to 1 month
  1. 26 Jul 2021 Promised availability (stated: in development for early 2025) in 2025. Intel 18A is already in development for early 2025 Intel Accelerates Process and Packaging Innovations (8-K Ex. 99.1)
  2. 27 Jul 2023 Promised manufacturing-ready in the second half of 2024. remain on track to being manufacturing-ready in 2H of 2024. Intel 2Q2023 Earnings Call Comments
  3. 1 Aug 2024 Promised production wafer start volumes in the first half of 2025. Intel 18A on track to be manufacturing-ready by the end of this year Intel Reports Second-Quarter 2024 Financial Results (8-K Ex. 99.1)
  4. 31 Jan 2025 Promised high-volume production in 2025. Intel 18A, that we expect to put into high-volume production in 2025 Intel Form 10-K for fiscal 2024
  5. 29 Apr 2025 Promised volume manufacturing in 2025. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry Gathers Customers and Partners, Outlines Priorities
  6. 9 Oct 2025 Promised high-volume production (stated: later this year) in 2025. Arizona’s Fab 52 is fully operational and set to reach high-volume production using Intel 18A later this year, Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
  7. 22 Jan 2026 Delivered: ramped to high-volume manufacturing (statement date). Intel 18A ramped to high-volume manufacturing in Arizona and Oregon Intel Reports Fourth-Quarter and Full-Year 2025 Financial Results (8-K Ex. 99.1)

Intel used different milestones (manufacturing-ready, wafer starts, volume, high-volume). The 2026-01-22 release lists the HVM ramp under Q4 2025; the 10-K says only 2025. 1 source could not be read when this record was checked, and its dates are left out.

Intel 14A Intel 14A · promised, not yet due
  1. 23 Jul 2026 Promised high-volume ramp in 2028. we remain on track for 14A risk production for our internal products in the second half of 2027 Intel Q2 2026 Earnings Call

We found no earlier Intel page with a dated 14A volume target; earlier dates came only from news. The fiscal 2025 10-K lists a possible pause of 14A as a risk. 1 source could not be read when this record was checked, and its dates are left out.

Samsung SF3E 3 nm, first-generation GAA · by the first date promised
  1. 7 Oct 2021 Promised production of customers’ first 3nm designs in the first half of 2022. GAA Is Ready for Customers’ Adoption – 3nm MP in 2022, 2nm in 2025 Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices
  2. 30 Jun 2022 Delivered: initial production started (company later calls it mass production). it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture

The 2019 release is the earliest dated Samsung statement we found; 3GAE was likely named earlier. The ceremony page shows the event day (July 25) only; we set 2022 from its text ('last month').

Samsung SF3 3 nm, second-generation GAA · past its date, no dated delivery on record
  1. 7 Oct 2021 Promised second-generation 3nm (no production term) in 2023. while its second generation of 3nm is expected in 2023. Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices
  2. 31 Oct 2023 Promised mass production in 2024. Looking ahead to 2024, the foundry market is expected to return to a state of growth Samsung Electronics Announces Third Quarter 2023 Results
  3. 13 Jun 2024 Promised mass production in the second half of 2024. Samsung plans to mass produce its second-generation 3nm process (SF3) in the second half of this year Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024

The 2024-07-31 results text ties 2024 growth to SF3 mass production, but it does not clearly say mass production started. So delivered is null.

Samsung SF2 2 nm, first generation · by the first date promised
  1. 7 Oct 2021 Promised mass production in 2025. Newly added to Samsung’s technology roadmap, the 2nm process node with MBCFET Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices
  2. 4 Oct 2022 Promised mass production in 2025. Samsung targets mass production of 2nm process technology by 2025 and 1.4nm by 2027 Samsung Electronics Unveils Plans for 1.4nm Process Technology at Samsung Foundry Forum 2022
  3. 28 Jun 2023 Promised mass production (mobile) in 2025. The company will begin mass production of the 2nm process for mobile applications in 2025, Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
  4. 31 Jul 2024 Promised mass production in 2025. to customers ahead of mass production in 2025. Samsung Electronics Announces Results for Second Quarter of 2024
  5. 30 Apr 2025 Promised mass production start in the second half of 2025. Looking ahead to H2 2025, the Foundry Business aims to start 2nm mass production Samsung Electronics Announces First Quarter 2025 Results
  6. 31 Jul 2025 Promised mass production ramp (new mobile SoC) in the second half of 2025. the Foundry Business will ramp up mass production of a new mobile SoC with the 2nm GAA process. Samsung Electronics Announces Second Quarter 2025 Results
  7. the fourth quarter of 2025 Delivered: mass production of first-generation 2nm products started (Q4 2025). The Business also commenced mass production of first-generation 2nm products Samsung Electronics Announces Fourth Quarter and FY 2025 Results

Samsung gives the 2nm start as Q4 2025 only. The 2023 promise named mobile first, then HPC in 2026 and automotive in 2027.

Samsung 2 nm gen 2 2 nm, second generation · promised, not yet due
  1. 29 Jan 2026 Promised production ramp in 2026. It plans to ramp up production of second-generation 2nm products Samsung Electronics Announces Fourth Quarter and FY 2025 Results
  2. 30 Apr 2026 Promised production ramp (mobile) in the second half of 2026. the Foundry Business plans to start ramping up production of the second-generation 2nm process for mobile products, Samsung Electronics Announces First Quarter 2026 Results

These pages do not use the name SF2P. The 2026-07-30 results still describe the ramp as a plan for H2 2026.

Samsung SF2Z 2 nm · promised, not yet due
  1. 13 Jun 2024 Promised mass production in 2027. Mass production of SF2Z is slated for 2027. Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024

SF2Z is a future node. We found no later Samsung restatement.

Samsung SF1.4 1.4 nm · promised, not yet due
  1. 4 Oct 2022 Promised mass production in 2027. Samsung targets mass production of 2nm process technology by 2025 and 1.4nm by 2027 Samsung Electronics Unveils Plans for 1.4nm Process Technology at Samsung Foundry Forum 2022
  2. 28 Jun 2023 Promised mass production in 2027. Mass production of SF1.4 will begin in 2027 as planned. Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
  3. 13 Jun 2024 Promised mass production in 2027. performance and yield targets on track for mass production in 2027. Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024

News reports say Samsung moved SF1.4 to 2029. We found no Samsung page that states 2029, so we did not add it. The 2026-04-30 text gives no year.

Rapidus 2nm GAA 2 nm · promised, not yet due
  1. 27 Feb 2026 Promised mass production in 2027. mass production of 2nm logic semiconductors by 2027 Rapidus Secures 267.6 Billion Yen in Funding from Japan Government and Private Sector Companies

We did not find a dated Rapidus page from 2022 that first set the 2027 target. The rapidus.inc news index did not load. 2 sources could not be read when this record was checked, and their dates are left out.

DRAM

Micron 1β (1-beta) 10nm-class DRAM (fifth generation) · after the first date promised, up to 12 months
  1. 7 Oct 2022 Promised start ramping in manufacturing (by end of calendar 2022) in 2022. our newest node, 1ß, is on track to start ramping in manufacturing by the end of calendar 2022. Micron Form 10-K for fiscal 2022
  2. 2023 Delivered: began shipping the 1β production node (2023). In 2023, we began shipping the industry’s first 1β (1-beta) production node, Micron Form 10-K for fiscal 2024

Micron said 'mass production readiness' on 2022-11-01, not mass production. Its filings give 2023 as the year it began shipping the production node. 1 source could not be read when this record was checked, and its dates are left out.

Micron 1γ (1-gamma) 10nm-class DRAM (sixth generation, first Micron EUV DRAM) · by the first date promised
  1. 4 Oct 2024 Promised volume production (calendar 2025) in 2025. we are on track for volume production in calendar 2025. Micron Form 10-K for fiscal 2024
  2. 2025 Delivered: began shipping the 1γ production node (2025). In 2025, we began shipping the industry’s first 1γ (1-gamma) production node, Micron Form 10-K for fiscal 2025

The 2025-02-25 shipment was of samples, not volume. Micron gives only the year 2025 for the production node. 2 sources could not be read when this record was checked, and their dates are left out.

SK hynix 1bnm fifth-generation 10nm-class DRAM · past its date, no dated delivery on record
  1. 30 May 2023 Promised mass production in the second half of 2023. Mass production of industry’s most advanced 1bnm DDR5 to help improve 2H23 earnings SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM

We found no SK hynix statement that says 1bnm mass production started. The 2023-10-26 text implies output but gives no start, so delivered is null.

SK hynix 1cnm sixth-generation 10nm-class DRAM · after the first date promised, up to 10 months
  1. 29 Aug 2024 Promised ready for mass production (within the year) in 2024. it will be ready for mass production of the 1c DDR5 within the year to start volume shipment next year. SK hynix Develops Industry’s First 1c DDR5
  2. 29 Aug 2024 Promised volume shipment in 2025. it will be ready for mass production of the 1c DDR5 within the year to start volume shipment next year. SK hynix Develops Industry’s First 1c DDR5
  3. 29 Oct 2025 Delivered: in stable mass production (statement date). its most advanced 1cnm process, or the sixth-generation of the 10-nanometer technology, which is already in stable mass production. SK hynix Announces 3Q25 Financial Results

SK hynix gives no start date for 1c mass production. The delivered date is the first statement we found.

Samsung 1b DRAM 12nm-class DRAM · by the first date promised
  1. 6 Oct 2022 Promised mass production in 2023. Samsung’s 1b DRAM is currently under development with plans for mass production in 2023. Samsung Electronics Envisions Hyper-Growth ... at Samsung Tech Day 2022
  2. 21 Dec 2022 Promised mass production in 2023. Set to begin mass production in 2023, Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM
  3. 18 May 2023 Delivered: mass production started. Samsung Electronics Announces Most Advanced 12nm-Class DDR5 DRAM Has Started Mass Production Samsung Electronics Announces Most Advanced 12nm-Class DDR5 DRAM Has Started Mass Production

Samsung calls this node '12nm-class' in product releases and '1b' in results. We matched them because Samsung uses both names for its 32Gb DDR5; Samsung does not say so in one sentence.

Samsung 1c sixth-generation 10nm-class DRAM · delivered, no promise on record
  1. 12 Feb 2026 Delivered: 1c in use for HBM4 mass production (statement date). the company achieved stable yields and industry-leading performance from the outset of mass production Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing

We found no Samsung page that announced 1c or gave a dated 1c promise. Samsung's 2023 Tech Day names an 11nm-class DRAM, but no page we read links it to 1c.

HBM

SK hynix HBM3E fifth-generation HBM · by the first date promised
  1. 30 May 2023 Promised mass production in 2024. begin mass production in 2024 SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM
  2. 21 Aug 2023 Promised mass production in the first half of 2024. SK hynix plans to mass produce HBM3E from the first half of next year SK hynix Develops World’s Best Performing HBM3E
  3. 19 Mar 2024 Delivered: volume production started (8-high). for supply to a customer from late March. SK hynix Begins Volume Production of Industry’s First HBM3E

The first HBM3E mention is a footnote on 2023-05-30; the development release is 2023-08-21. The 12-layer version followed on 2024-09-26.

SK hynix HBM4 sixth-generation HBM · by the first date promised
  1. 19 Mar 2025 Promised mass production in the second half of 2025. Mass production of products with best-in-class bandwidth and capacity to start in 2H 2025 following certification process SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers
  2. 29 Oct 2025 Promised shipments in the fourth quarter of 2025. HBM4, which completed development in September and entered mass production, SK hynix Announces 3Q25 Financial Results
  3. 29 Oct 2025 Delivered: entered mass production (statement date). Shipments will begin in the fourth quarter this year, SK hynix Announces 3Q25 Financial Results

On 2025-09-12 SK hynix said it was ready for mass production, not that it started. Mass shipments came in Q2 2026, after the Q4 2025 shipment promise.

Samsung HBM3E HBM3E (Shinebolt); fifth-generation HBM · by the first date promised
  1. 27 Feb 2024 Promised mass production (12H) in the first half of 2024. mass production is slated for the first half of this year. Samsung Develops Industry-First 36GB HBM3E 12H DRAM
  2. April 2024 Delivered: mass production of HBM3E 8H started (April 2024). The Company started mass production of HBM3E 8H this month Samsung Electronics Announces First Quarter 2024 Results

The 12H promise and the 8H delivery are different stack heights. We found no Samsung statement of the date 12H mass production started.

Samsung HBM4 sixth-generation HBM · by the first date promised
  1. 30 Oct 2025 Promised mass production in 2026. Going forward in 2026, the Memory Business will focus on the mass production of HBM4 products Samsung Electronics Announces Third Quarter 2025 Results
  2. 29 Jan 2026 Promised delivery to customers in the first quarter of 2026. The Memory Business is on track to begin delivering HBM4 products this quarter Samsung Electronics Announces Fourth Quarter and FY 2025 Results
  3. 12 Feb 2026 Delivered: mass production started and commercial products shipped. it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing

We found no Samsung page that first announced HBM4. The 2025-10-30 results say HBM4 samples were shipping then.

Micron HBM3E fifth-generation HBM · past its date, no dated delivery on record
  1. 6 Oct 2023 Promised mass production ramp (stated: early calendar 2024) in 2024. have begun sampling our industry-leading HBM3E product offering. Micron Form 10-K for fiscal 2023

Micron first sampled this product in July 2023 under the name 'HBM3 Gen2'. We use the first HBM3E name in its filings as the announced date. 1 source could not be read when this record was checked, and its dates are left out.

Micron HBM4 sixth-generation HBM · promised, not yet due
  1. 3 Oct 2025 Promised volume production in 2026. Our HBM4 technology is advancing and remains on schedule for volume production in calendar 2026. Micron Form 10-K for fiscal 2025

We found no Micron page that first announced HBM4 with a date. Micron gives the start as a calendar quarter only. 1 source could not be read when this record was checked, and its dates are left out.

NAND

SK hynix 238L NAND 238-layer 4D NAND · by the first date promised
  1. 2 Aug 2022 Promised mass production in the first half of 2023. with a plan to start mass production in the first half of 2023. SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
  2. May 2023 Delivered: mass production started (May 2023). has moved into mass production in May, SK hynix Begins Mass Production of Industry’s Highest 238-Layer 4D NAND

The 2023-06-08 release dates the start to May 2023 with no day.

SK hynix 321L NAND 321-layer 4D NAND · by the first date promised
  1. 9 Aug 2023 Promised mass production in the first half of 2025. start mass production from the first half of 2025. SK hynix Showcases Samples of World’s First 321-Layer NAND
  2. 21 Nov 2024 Delivered: mass production started (TLC, 1Tb). The company plans to provide the 321-high products to customers from the first half of next year. SK hynix Starts Mass Production of World’s First 321-High NAND

SK hynix started mass production before the promised date. Supply to customers was set for 1H 2025.

Samsung V-NAND V8 8th-generation V-NAND · by the first date promised
  1. 6 Oct 2022 Promised available to customers (1Tb TLC, by end of year) in 2022. The world’s highest capacity 1Tb TLC V-NAND will be available to customers by the end of the year. Samsung Electronics Envisions Hyper-Growth ... at Samsung Tech Day 2022
  2. 7 Nov 2022 Delivered: mass production started (1Tb TLC). it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND With Industry’s Highest Bit Density

The Samsung pages we read do not state the V8 layer count, so generation is null. We did not use layer counts from news.

Samsung V-NAND V9 9th-generation V-NAND · by the first date promised
  1. 6 Oct 2022 Promised mass production in 2024. its ninth-generation V-NAND is under development and slated for mass production in 2024. Samsung Electronics Envisions Hyper-Growth ... at Samsung Tech Day 2022
  2. 23 Apr 2024 Delivered: mass production started (1Tb TLC). it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND

The V9 release does not state a layer count, so generation is null. The QLC version followed in the second half of 2024.

Kioxia BiCS8 8th-generation BiCS FLASH, 218 layers · delivered, no promise on record
  1. 19 Feb 2025 Delivered: stated as currently in mass production (start date not given). compared with their 8th generation 3D flash memory currently in mass production, Kioxia and Sandisk Unveil Next-Generation 3D Flash Memory Technology

Kioxia gave no dated mass-production promise in the pages we read. It said 'initial production' on 2024-05-15 and 'in mass production' on 2025-02-19.

22 nodes and dates left out, and why

a date goes in only with a quote this site could read on the company’s own page
  • Samsung SF1.4 moved to 2029 Only news reports state it. No Samsung page that we found says 2029.
  • Intel 14A risk production in 2027 (said at Direct Connect 2025) Only news reports state it. The Intel 2025-04-29 release gives no 14A date.
  • TSMC N4, N4P, N4C, N5P, N2U, A12 Variants or intermediate nodes outside the scope of this record. N2U (2028) and A12 (2029) are in TSMC release 3302; N4C (2025) is in release 3136.
  • Intel 18A-P (risk production June 2026) A variant of 18A. It is in the Intel 10-Q for Q2 2026.
  • Samsung SF2X, SF2A, SF4U Variants outside the scope of this record. SF4U mass production 2025 is in the SFF 2024 release.
  • Kioxia 6th-generation BiCS (162 layers, announced 2021-02-18) Below 200 layers; no dated mass-production statement found.
  • Kioxia 9th-generation BiCS Kioxia does not state a layer count on the pages we read; samples shipped 2025-07-25.
  • SK hynix 321-layer QLC NAND and HBM4E; Samsung HBM4E Variants or next nodes outside the scope of this record.
  • Micron 1δ (1-delta) DRAM Future node with no dated promise in the pages we read.
  • Samsung 11nm-class DRAM (Memory Tech Day 2023) No Samsung page we read links the name '11nm-class' to '1c', so we did not merge them.
  • Rapidus 'About' timeline entry for 2027 The page has no publication date, so it cannot be a dated promise.
  • TSMC N3E No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC N3P No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC N3X No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC N2P No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC A16 No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC A14 No page that dates it could be read when this record was checked. It returns when one can be.
  • TSMC A13 No page that dates it could be read when this record was checked. It returns when one can be.
  • Micron 1α (1-alpha) No page that dates it could be read when this record was checked. It returns when one can be.
  • Micron 232-layer NAND (G8) No page that dates it could be read when this record was checked. It returns when one can be.
  • Micron G9 NAND No page that dates it could be read when this record was checked. It returns when one can be.
  • Kioxia 10th-generation BiCS FLASH No page that dates it could be read when this record was checked. It returns when one can be.
  • Each company’s own press releases, earnings statements and annual reports, and TSMC’s, Micron’s and Intel’s filings with the SEC. Every quote above links to its page. Each page was read and each quote checked on 19 Oct 2026.